Peralatan Lapisan Semprot Ultrasonik Dengan Daya Maksimum 1-15W Dan Seragam Semprot ≥95%

Mesin Lapisan Semprot Ultrasonik
March 11, 2025
Video Description:
Discover the advanced Ultrasonic Semiconductor Wafer Coating technology by FUNSONIC, designed for precise and uniform wafer coating. This equipment features a max power of 1-15W and spray uniformity ≥95%, ensuring high-quality chip bonding adhesives and films. Ideal for photolithography, protective coatings, and functional applications.